Thick Film

SUBSTRATES

• Alumina (Al203):
  • 96% to 99.6%
  • 0.005" to 0.080" thick
  • Area up to 6" x 8"
  • CO2 Numerically Controlled Laser allows any shapes and sizes
• 99% Beryllia (BeO):
  • Conducts heat almost as well as copper
  • 0.015" to 0.080" thick (0.025" typical)
  • Area up to 4"x 4"
• Aluminum Nitride (AlN):
  • 0.020" to 0.040" thick (0.025" typical)
  • Area up to 4" x 4"
  • Conducts heat almost as well as BeO, with lower toxicity

CONDUCTORS

• Screened Gold:
  • 0.005" lines and spaces @ 4 milliohms/sq.
  • Wire bondable
  • Low resistance runs
  • 0.005" vias
• Etched 99.9% Gold:
  • 0.001" lines and spaces @ 2.8 milliohms/sq.
  • Outstanding performance to 80 GHz
  • Wire bondable
  • 0.005" vias
• Platinum Gold:
  • 0.006" lines and spaces @ 80 milliohms/sq.
  • Best solder aged adhesion
  • No migration
  • 0.008" vias
• Palladium Silver:
  • 0.005" lines and spaces @ 35 milliohms/sq.
  • All purpose conductor,
  • Good aged adhesion
  • 0.007" vias.
• Print-through holes:
  • 0.008" diameter (1/3 substrate thickness)

RESISTORS

Less than 0.3% drift from all environmental factors (Laser Trim, Solder Dip, 1000 hour Load Life, etc…)

DIELECTRICS

• Dielectric breakdown > 400 AC Volts/mil.
• Hermetic dielectric allows 18 conductor layers @ K = 9
• High K dielectric allows capacitors up to 0. 1 uF/sqin.
• Ultra Low Loss dielectric available for microwave applications