Thick Film

SUBSTRATES

  • Alumina (Al203):
    • 96% to 99.6%
    • 0.005" to 0.080" thick
    • Area up to 6" x 8"
    • CO2 Numerically Controlled Laser allows any shapes and sizes
  • 99% Beryllia (BeO):
    • Conducts heat almost as well as copper
    • 0.015" to 0.080" thick (0.025" typical)
    • Area up to 4"x 4"
  • Aluminum Nitride (AlN):
    • 0.020" to 0.040" thick (0.025" typical)
    • Area up to 4" x 4"
    • Conducts heat almost as well as BeO, with lower toxicity


CONDUCTORS

  • Screened Gold:
    • 0.005" lines and spaces @ 4 milliohms/sq.
    • Wire bondable
    • Low resistance runs
    • 0.005" vias
  • Etched 99.9% Gold:
    • 0.001" lines and spaces @ 2.8 milliohms/sq.
    • Outstanding performance to 80 GHz
    • Wire bondable
    • 0.005" vias
  • Platinum Gold:
    • 0.006" lines and spaces @ 80 milliohms/sq.
    • Best solder aged adhesion
    • No migration
    • 0.008" vias
  • Palladium Silver:
    • 0.005" lines and spaces @ 35 milliohms/sq.
    • All purpose conductor,
    • Good aged adhesion
    • 0.007" vias.
  • Print-through holes:
    • 0.008" diameter (1/3 substrate thickness)


RESISTORS

Less than 0.3% drift from all environmental factors (Laser Trim, Solder Dip, 1000 hour Load Life, etc…)

Resistance Range TCR Tolerance Power Density
< 10 ohms +/- 100 ppm/deg.C /td> +/- 0.25% 200 watts/in sq.
10 to 100K ohms +/- 50 ppm/deg.C +/- 0.10% 100 watts/in sq.
100K to 100M ohms +/- 100 ppm/deg.C +/- 0.50% 50 watts/in sq.
100M to 10G ohms +/- 250 ppm/deg.C +/- 2.00% 50 watts/in sq.


DIELECTRICS

  • Dielectric breakdown > 400 AC Volts/mil.
  • Hermetic dielectric allows 18 conductor layers @ K = 9
  • High K dielectric allows capacitors up to 0. 1 uF/sqin.
  • Ultra Low Loss dielectric available for microwave applications

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