Thick Film
SUBSTRATES
- Alumina (Al203):
- 96% to 99.6%
- 0.005" to 0.080" thick
- Area up to 6" x 8"
- CO2 Numerically Controlled Laser allows any shapes and sizes
- 99% Beryllia (BeO):
- Conducts heat almost as well as copper
- 0.015" to 0.080" thick (0.025" typical)
- Area up to 4"x 4"
- Aluminum Nitride (AlN):
- 0.020" to 0.040" thick (0.025" typical)
- Area up to 4" x 4"
- Conducts heat almost as well as BeO, with lower toxicity

CONDUCTORS
- Screened Gold:
- 0.005" lines and spaces @ 4 milliohms/sq.
- Wire bondable
- Low resistance runs
- 0.005" vias
- Etched 99.9% Gold:
- 0.001" lines and spaces @ 2.8 milliohms/sq.
- Outstanding performance to 80 GHz
- Wire bondable
- 0.005" vias
- Platinum Gold:
- 0.006" lines and spaces @ 80 milliohms/sq.
- Best solder aged adhesion
- No migration
- 0.008" vias
- Palladium Silver:
- 0.005" lines and spaces @ 35 milliohms/sq.
- All purpose conductor,
- Good aged adhesion
- 0.007" vias.
- Print-through holes:
- 0.008" diameter (1/3 substrate thickness)
RESISTORS
Less than 0.3% drift from all environmental factors (Laser Trim, Solder Dip, 1000 hour Load Life, etc…)
Resistance Range |
TCR |
Tolerance |
Power Density |
< 10 ohms |
+/- 100 ppm/deg.C /td>
| +/- 0.25% |
200 watts/in sq. |
10 to 100K ohms |
+/- 50 ppm/deg.C |
+/- 0.10% |
100 watts/in sq. |
100K to 100M ohms |
+/- 100 ppm/deg.C |
+/- 0.50% |
50 watts/in sq. |
100M to 10G ohms |
+/- 250 ppm/deg.C |
+/- 2.00% |
50 watts/in sq. |
DIELECTRICS
- Dielectric breakdown > 400 AC Volts/mil.
- Hermetic dielectric allows 18 conductor layers @ K = 9
- High K dielectric allows capacitors up to 0. 1 uF/sqin.
- Ultra Low Loss dielectric available for microwave applications
|