A B C D E F G H IJK L M N O P QR S T UV W XYZ

Package
The container for an electronic component(s) with terminals to provide electrical access to the outside of the container. In addition, the container usually provides environmental protection (hermeticity), and a defined form factor.

Package Cap
The cup-like cover that encloses the package in the final sealing operation.

Package Lid
A flat cover plate that is used to seal a package cavity.

Pad
A metallized area on the surface of an active substrate as an integral portion of the conductive interconnection pattern to which bonds or test probes may be applied.

Passivation
The formation of an insulating layer directly over a circuit or circuit element to protect the surface from contaminants, moisture, or particles.

Passive Components (Elements)
Elements such as resistors, capacitors, and inductors which do not change their basic character when an electrical signal is applied. Transistors and electron tubes are active components.

Paste
Synonymous with "composition" and "ink" when relating to screenable thick-film materials

Paste Blending
Mixing a resistor paste of different ohms/square value to create a third value in between those of the two original materials.

Paste Soldering
Finely divided particles of solder suspended in a flux paste. Applied by screening on to a film circuit and reflowing. Forms connections to solderable components.

Pattern
The outline of a collection of circuit conductors and resistors that defines the area to be covered by the material on a film circuit substrate.

Peak Firing Temperature
The maximum temperature seen by the resistor or conductor paste in the firing cycle as defined by the firing profile.

Percent Defective Allowable (PDA)
The maximum observed percent defective which will permit the lot to be accepted after the specified 100% Test.

Pinhole
Small holes occurring as imperfections which penetrate entirely through film elements, such as metallization films or dielectric films

Plastic Encapsulation
Environmental protection of a completed circuitry embedding it in a plastic such as epoxy or silicone.

Plastic Shell
A thin plastic cup or box used to enclose an electronic circuit for environmental protection or used as a means to confine the plastic encapsulant used to embed the circuit.

Potting
Encapsulating of a circuit in plastic.

Power Density
The amount of power dissipated from a film resistor through the substrate. Measured in W/in2.

Power Dissipation
The dispersion of the heat generated from a film circuit when a current flows through it.

Preseal Visual
The process of visual inspection of a completed hybrid circuit assembly for defects prior to sealing the package.

Print and Fire
A term sometimes used to indicate steps in the thick-film process wherein the ink is printed on a substrate and is fired.

Printing Parameters
The conditions that affect the screening operation such as off-contact spacing, squeegee speed, squeegee pressure, etc.

Production Lot
Hybrid microcircuits manufactured on the same production line(s) by means of the same productions techniques, materials, controls, and design, The production lot is usually date coded to permit control and traceability required for maintenance of reliability programs.

Purple Plague
One of several gold-aluminum compounds formed when bonding gold to aluminum and activated by re-exposure to moisture and elevated temperature (<340 deg. C). Purple plague is purplish in color and is very brittle, potentially leading to time-based failure of the bonds. Its growth is highly enhanced by the presence of silicon to form ternary compounds.


Home
   About HSI   Design   Thick Film    Assembly   Quality   Getting Started    Glossary   Contact Us