The container for an electronic component(s) with terminals to provide electrical access to the outside of the container. In addition, the container usually provides environmental protection (hermeticity), and a defined form factor.
The cup-like cover that encloses the package in the final sealing operation.
A flat cover plate that is used to seal a package cavity.
A metallized area on the surface of an active substrate as an integral portion of the conductive interconnection pattern to which bonds or test probes may be applied.
The formation of an insulating layer directly over a circuit or circuit element to protect the surface from contaminants, moisture, or particles.
Passive Components (Elements)
Elements such as resistors, capacitors, and inductors which do not change their basic character when an electrical signal is applied. Transistors and electron tubes are active components.
Synonymous with "composition" and "ink" when relating to screenable thick-film materials
Mixing a resistor paste of different ohms/square value to create a third value in between those of the two original materials.
Finely divided particles of solder suspended in a flux paste. Applied by screening on to a film circuit and reflowing. Forms connections to solderable components.
The outline of a collection of circuit conductors and resistors that defines the area to be covered by the material on a film circuit substrate.
Peak Firing Temperature
The maximum temperature seen by the resistor or conductor paste in the firing cycle as defined by the firing profile.
Percent Defective Allowable (PDA)
The maximum observed percent defective which will permit the lot to be accepted after the specified 100% Test.
Small holes occurring as imperfections which penetrate entirely through film elements, such as metallization films or dielectric films
Environmental protection of a completed circuitry embedding it in a plastic such as epoxy or silicone.
A thin plastic cup or box used to enclose an electronic circuit for environmental protection or used as a means to confine the plastic encapsulant used to embed the circuit.
Encapsulating of a circuit in plastic.
The amount of power dissipated from a film resistor through the substrate. Measured in W/in2.
The dispersion of the heat generated from a film circuit when a current flows through it.
The process of visual inspection of a completed hybrid circuit assembly for defects prior to sealing the package.
Print and Fire
A term sometimes used to indicate steps in the thick-film process wherein the ink is printed on a substrate and is fired.
The conditions that affect the screening operation such as off-contact spacing, squeegee speed, squeegee pressure, etc.
Hybrid microcircuits manufactured on the same production line(s) by means of the same productions techniques, materials, controls, and design, The production lot is usually date coded to permit control and traceability required for maintenance of reliability programs.
One of several gold-aluminum compounds formed when bonding gold to aluminum and activated by re-exposure to moisture and elevated temperature (<340 deg. C). Purple plague is purplish in color and is very brittle, potentially leading to time-based failure of the bonds. Its growth is highly enhanced by the presence of silicon to form ternary compounds.