The base of a hybrid circuit package that holds the leads.
The supporting member to which electronic components or their substrate or their package bottom are attached. This is usually a heat conductive metal with the ability to rapidly transmit heat from the generating source (component).
Sealed up so that it is gas tight. The test for hermeticity is to observe leak rates when placed in a vacuum. A plastic encapsulation cannot be hermetic by definition because there is no internal volume of gas to escape.
A small area on a circuit that is unable to dissipate the generated heat and therefore operates at an elevated temperature above the surrounding area.
A microcircuit consisting of elements which are a combination of the film circuit type and the semiconductor circuit type or a combination of one or both of these types and may include discrete add-on components.
The entire body of electronic art which is connected with or applied to the realization of electronic systems using hybrid circuit technology.