A term that describes the amount of overall warpage present in a substrate.
Testing the integrity of bonds in a hybrid circuit by spinning the circuit at a high rate of speed thereby imparting a high G loading in the interconnecting wire bonds and bonded elements.
Inorganic nonmetallic material such as alumina, beryllia, steatite, or for sterite, whose final characteristics are produced by subjection to high temperatures, often used in microelectronics as parts of components, substrate, or package.
The uncased and normally leadless form of an electronic component part, either passive or active, discrete or integrated.
Chip and Wire
A hybrid technology employing face-up bonded chip devices exclusively, interconnected to the substrate conventionally by flying wires.
A special type of enclosure or package used to house semiconductors
The interconnection of a number of electrical elements and /or devices, performing a desired electrical function.
Processing more than one type of the thick-film paste through the firing cycle at the same time - usually refers to conductors and resistors.
Active or passive elements, devices, integrated or functional circuits, which are intended to be attached to a circuit board or substrate carrier.
An epoxy material (polymer resin) that has been made conductive by the addition of a metal powder, usually gold or silver.
The ability of a material to conduct electricity; the reciprocal of resistivity.
The distance between adjacent conductor film edges.
The width of individual conductors in a conductive film pattern.
A thin nonconductive coating, either plastic (e.g., poly-p-xylylene) or inorganic, applied to a circuit for environmental and/or mechanical protection.
Continuous Belt Furnace
A firing furnace that has a continuous belt, carrying the unfired substrates through the firing cycle.
Transverse crossing of metallization paths without mutual electrical contact and achieved by the deposition of an insulating layer between the conducting paths at the area of crossing.
Signals from one line leaking into another nearby conductor because of capacitance or inductive coupling or both (e.g. owing to capacitance of a thick-film crossover).
Cut and Strip
An essentially obsolete method of producing artwork using a two-ply laminated plastic sheet, by cutting and stripping off the unwanted portion of the opaque layer from the translucent layer, leaving the designed art work configuration.