Subjecting an unsealed hybrid circuit package to an elevated temperature to "bake out" moisture and unwanted gases prior to final sealing.
An attachment formed when a ball shaped end interconnecting wire is deformed by thermo-compression against a metallized pad. The bond is also designated a "Nailhead Bond" from the appearance of the flattened ball.
An interconnection that performs a permanent electrical and/or mechanical function.
In wire bonding, the pull force at rupture of the bond interface measured in the unit gram-force.
Attaching the semiconductor chip to the substrate, either with an epoxy, eutectic or solder alloy.
The process of electrically stressing a device (usually at an elevated temperature) for an adequate period of time to cause failure of marginal devices.