A B C D E F G H IJK L M N O P QR S T UV W XYZ

Bake Out
Subjecting an unsealed hybrid circuit package to an elevated temperature to "bake out" moisture and unwanted gases prior to final sealing.

Ball Bond
An attachment formed when a ball shaped end interconnecting wire is deformed by thermo-compression against a metallized pad. The bond is also designated a "Nailhead Bond" from the appearance of the flattened ball.

Bond
An interconnection that performs a permanent electrical and/or mechanical function.

Bond Strength
In wire bonding, the pull force at rupture of the bond interface measured in the unit gram-force.

Bonding Di
Attaching the semiconductor chip to the substrate, either with an epoxy, eutectic or solder alloy.

Burn-In
The process of electrically stressing a device (usually at an elevated temperature) for an adequate period of time to cause failure of marginal devices.


Home
   About HSI   Design   Thick Film    Assembly   Quality   Getting Started    Glossary   Contact Us