Assembly

SOLDER REFLOW
Leadless chip carriers, S.O. Packages, Discrete devices, Capacitors, Inductors


CHIP and WIRE

  • 0.0007" to 0.0020" Gold thermosonic ball bonding
  • Epoxy and Eutectic die attach
  • Moly tab high temperature solder mount
  • 0.001" to 0.010" Aluminum ultrasonic wedge bonding


PACKAGING

  • Hermetic packages: welded Metal cans, soldered Ceramic
  • Epoxy sealed Ceramic and Plastic enclosures, custom shapes
  • Conformally Coated Epoxy or Silicone DIPs and SIPs
  • Standard and Custom fabricated Heat Sinks


DISCRETE COMPONENTS

  • Semiconductors:
    • Bipolar
    • ECL
    • MOS
    • Gate Arrays
    • FETs

  • Chip Capacitors:
    • 5pF to 0.5uF
    • NPO through Z5U
    • Up to 50V

  • Tantalum Capacitors:
    • 0.1uF to 50uF
    • Up to 25V

  • Chip Resistors:
    • Thin Film
    • Tight tolerance
    • Low TCR

  • Inductors and Chip Inductors:
    • Standard products and custom wound cores available

  • Variable Capacitors:
    • 1 pF to 100 pF

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