Thick Film Advantages


  • Operates from DC to 20 GHz (Screened Au) or DC to 80 GHz (Etched Au)
  • Minimum geometries improve high frequency performance
  • Thick film resistors provide excellent thermal tracking
  • Active resistor trimming compensates for component variations
  • 0.1% Resistor ratios and absolute values possible
  • High dielectric isolation with increased high frequency response
  • Hybrid substrate combines electrical and mechanical functions
  • Variety of voltages, power levels, frequencies, arrays, etc…


  • Substantial size and weight reductions
  • Pin-outs and packaging optimized to simplify system integration
  • Increased thermal dissipation and reduced temperature gradients
  • Packaged hybrids are almost indestructible
  • Proprietary packaging precludes reverse engineering of your design
  • Operational over extreme temperature range
  • True integration of semiconductor and passive device technologies
  • Hybrids allow minimal inventory, handling and assembly labor


  • Technological maturity allows reliability optimization in design
  • Ceramic substrates dissipate heat quickly -circuits run cooler
  • Minimal number of solder joints and interconnections
  • Automation optimizes error-free production
  • 850 degree C resistor firing insures stability at operating temperature
  • Vendor qualification and incoming inspection maintains standards
  • Adherence to military documentation insures traceability
  • Environmental screening and burn-in increase MTBF


  • High reliability minimizes expensive field failures
  • Automation of substrate fabrication and assembly reduces cost
  • Compact circuitry reduces system bulk to increase performance
  • Modest tooling and development expense
  • Functional trimming allows use of wider tolerance components
  • Screen printing offers cost effective resistor fabrication
  • Wide range of available components allows cost effective choices
  • Flexibility in design facilitates changes and modifications

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