Thick Film Advantages

ELECTRICAL

• Operates from DC to 20 GHz (Screened Au) or DC to 80 GHz (Etched Au)
• Minimum geometries improve high frequency performance
• Thick film resistors provide excellent thermal tracking
• Active resistor trimming compensates for component variations
• 0.1% Resistor ratios and absolute values possible
• High dielectric isolation with increased high frequency response
• Hybrid substrate combines electrical and mechanical functions
• Variety of voltages, power levels, frequencies, arrays, etc…

MECHANICAL

• Substantial size and weight reductions
• Pin-outs and packaging optimized to simplify system integration
• Increased thermal dissipation and reduced temperature gradients
• Packaged hybrids are almost indestructible
• Proprietary packaging precludes reverse engineering of your design
• Operational over extreme temperature range
• True integration of semiconductor and passive device technologies
• Hybrids allow minimal inventory, handling and assembly labor

RELIABILITY

• Technological maturity allows reliability optimization in design
• Ceramic substrates dissipate heat quickly -circuits run cooler
• Minimal number of solder joints and interconnections
• Automation optimizes error-free production
• 850 degree C resistor firing insures stability at operating temperature
• Vendor qualification and incoming inspection maintains standards
• Adherence to military documentation insures traceability
• Environmental screening and burn-in increase MTBF

ECONOMY

• High reliability minimizes expensive field failures
• Automation of substrate fabrication and assembly reduces cost
• Compact circuitry reduces system bulk to increase performance
• Modest tooling and development expense
• Functional trimming allows use of wider tolerance components
• Screen printing offers cost effective resistor fabrication
• Wide range of available components allows cost effective choices
• Flexibility in design facilitates changes and modifications