THE source for quality Thick Film substrates and innovative hybrid assemblies.

ThickFilm Substrates
Amplifiers
Custom Packaging
Hermeticity
Instrumentation Solution #1
Instrumentation Solution #2
Medical Solution #1
Medical Solution #2
Medical Solution #3
Microwave
Sensors
Surface Mount Commercial
Surface Mount Military


Thick Film Substrates

Customer Required: Thickfilm substrate with printed through holes, resistors, multilayer dielectric, Pd/Ag and Au conductor and protective glass encapsulation. Used in the fabrication of chip and wire hybrid circuits, leadless chip carrier motherboards, sensor elements, assemblies, etc.

Hybrid Solution: Thick film pastes printed on alumina and BeO per customer's drawings and/or schematics. Material selection to maximize reliability within required cost constraints.

Technical considerations: Conductors: solderability and leach resistance, bond strength, conductivity. Resistors: TCR, VCR, absolute value, ratios and tolerance, power, long term drift. Multilayer dielectric: dielectric constant, voltage breakdown.

Reliability: Mil specs based upon properties of thick film materials. Over thirty years of reliability data available. Performance of any given product dependent upon the materials and design utilized.

Cost effectiveness: Precious metals utilized in most compositions.

Alternative technology: 99% AI2O3 substrates used by thin film manufacturers at substantially higher expense, with limited resistor range and low power handling. Printed circuit boards utilized when size and reliability are not at issue.

Delivery: 2-6 weeks, depending upon complexity and engineering design requirements. Typical yields: 90-98%.

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Amplifiers

Customer Required: 38 channel very low noise amp - single-in-line output - 1" max height.

Hybrid Solution: Two identical nineteen channel hybrids with 3 gig ohm resistors & 0.5 pf screen printed planar capacitors (matched) in feedback loop. Guarded inputs, double sided ceramic, plated through holes and high value decoupling capacitors.

Technical considerations: Custom fabrication of high value, low noise resistors with associated capacitor, selected to match output of all channels within 5%. Layout minimizes cross talk between channels - ground traces on substrate minimize resistance and inductance.

Reliability: Commercial packaging with epoxy sealed ceramic lid. 100% electrical performance check for noise and gain.

Cost effectiveness: Nonrecurring engineering expense approximates $2,500. Unit pricing at 1,000 = $80.

Alternative technology: Glass/epoxy printed circuit board - approximately four times larger, with stray capacitance causing substantial reduction in performance. Matching of discrete resistors not cost effective.

History: 5 weeks for design plus 3 weeks for initial units. Redesign and second prototyping: 4 weeks. Production at a rate of 40/week. Production yields = 95%.

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Custom Packaging:

Customer Required: Custom infrared sensor package with optical window. High output pin count using standard components. Final sensor positioning within ± 0.001".

Hybrid Solution: CO2 lasered ceramic with matching window frame. Plated holes enabling multiple conductor levels. Mechanical integrity provided by using shoulder pins. Circular and slotted holes allow mechanical positioning.

Technical considerations: 0.010" pad spacing matches IC sensor; 0.100" double row edge pinout. Twenty mil thick, ultra flat window frame.

Reliability: High temperature solder utilized to minimize reflow upon final package installation. 0.0005" minimum gold conductor printed over palladium/silver conductor for high reliability gold thermosonic wire bonding. Epoxy seal of window frame to base allows thermal dissipation of greater than 5 watts per square inch.

Cost effectiveness: $1,200 non-recurring engineering expense. Unit pricing at 50 = $30.

Alternative technology: Custom package using refractory metals. Cost in excess of $12,000, with lead time approaching twelve weeks.

History: Two weeks for design plus one week for associated jigs and fixtures. Two weeks for production fabrication. Yields = 98%.

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Hermeticity

Customer Required: Hybrid packages immune from moisture and other environmental considerations. High reliability - mostly military applications. Emi/RFI shielding provided by metal cases. Packages often provide mounting holes and/or connectors.

Hybrid Solution: Standard packages, commercially available: flat packs, dual in line cans, etc. Typically fabricated from ceramic, kovar or mild steel. Some custom packages purchased commercially. Custom ceramic lids may be soldered on top of dielectric isolation rings. Electron beam welding of custom fabricated stainless steel cases for the ultimate in ruggedness often make up the final housing.

Technical considerations: High reliability, in, wire bond pull test and electrical characterization often associated with this type of package. Careful layout and material selection optimize reliability.

Reliability: Meets all Mil-Std-883 level S requirements. 100% leak testing insures hermeticity.

Cost effectiveness: Highly dependent upon package type. Costs are balanced against required life expectancy and reliability in end use.

Alternative technology: Silicone and epoxy encapsulation used for commercial product. Epoxy application of ceramic cover offers slightly lower cost and performance. No alternative to the truly hermetic package.

History: Highly dependent upon part requirements, volume, size, etc.

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Instrumentation Solution #1

Customer Required: Eight channel multiplexer volt transformers and resistors -- high package density in a cost effective configuration.

Hybrid Solution: Double sided surface mounting of components for space efficiency. Precision high voltage resistor arrays with low TCR's. Closer than "standard" spacing between transistors.

Technical considerations: High voltage isolation between layers. Low TCR's of resistors printed on dielectric. Tight spacing of semiconductors - no shorting.

Reliability: Commercial product - no mil qualification. Final encapsulation with silicone moisture protectant. 100% electrical performance test and high voltage check.

Cost effectiveness: Non-recurring engineering approximates $2,900. Unit pricing at 200 = $90.

Alternative technology: Glass/epoxy printed circuit board approximately five times larger. High voltage, tight tolerance resistors not cost effective with discrete devices.

History: Layout: 4 weeks. Prototype fabrication: 6 weeks. Final delivery at a 50/month rate.

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Instrumentation Solution #2

Customer Required: Ultra high speed digital oscilloscope probe utilizing active circuitry at the point of measurement. Packaging to match existing passive devices. HSI assumed responsibility for procuring all components and associated assemblies.

Hybrid Solution: Laser cut ceramic with plated through holes. Mechanical switch, decoupling capacitors and chip and wire IC's. Epoxy covering of the active elements for low height and very low stray capacitance. Design insures low parasitic capacitance and a bandwidth > one mhz.

Technical considerations: Secure cable connection relief. Separate signal and power ground runs. Mechanical damage from excessive tip force minimized through mechanical decoupling of input.

Reliability: Commercial product packaging with epoxy. 100% electrical test for noise, gain, bandwidth and dc offset.

Cost effectiveness: $2,800 non-recurring engineering expense. Unit pricing at 1,000 = $140.

Alternative technology: Glass/epoxy pc board approximately eight times larger, with increased distance from point of measurement, and losses in the connecting cable, yielding a substantial reduction .

History: 3 weeks for design plus 3 weeks for initial units. Redesign and second prototyping: 4 weeks. Production at a rate of 40/week. Production yields = 95%.

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Medical Solution #1

Customer Required: Motor control & magnet sense circuitry capable of reliable operation after autoclave in a sterile surgical environment. Limited space. Electrically noisy environment. 100% burned-in and tested unit, ready to install.

Hybrid Solution: Hall effect sensors integrated into custom "probe." Stacked hybrid array maximizes volumetric efficiency. Carefully chosen system of materials to withstand salt water corrosion and temperature cycling. Electron beam weld into SS case.

Technical considerations: Extreme environmental conditions with mechanical and electrical final unit testing. 100% Mil-Std-883B qualification. Extensive prototype evaluation.

Reliability: Passes 3000 autoclave cycles without degradation.

Cost effectiveness: non-recurring engineering expense approximates $6,500. Unit pricing at 2,500 = $150.

Alternative technology: None

History: Layout: 8 weeks for five circuit levels plus a sensor. Prototype fabrication: 6 weeks. Reliability testing: 16 weeks. Modifications: 4 weeks. Second prototype run: 5 weeks. Final delivery at a 150/month rate.

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Medical Solution #2

Customer Required: Video receiving head for hospital operating rooms. High volumetric efficiency and moderate cost. Utilize standard, unpackaged vidicon sensors.

Hybrid Solution: Surface mounted semiconductors utilized in a three dimensional configuration. Reliability assured by burn-in and temperature cycling of each unit. Optical and electrical performance of each module individually characterized.

Technical considerations: Plated through holes. Hand soldered connections to vidicon sensor minimize heat transfer. Surface mounted components.

Reliability: Although commercial, hospital usage requires military reliability. Burn-in, temperature cycling and mil quality components guarantee performance.

Cost effectiveness: Non-recurring engineering expense approximates $2,500. Unit pricing at 1,000 = $140.

Alternative technology: None

History: Layout: 8 weeks. Prototype fabrication: 6 weeks. Final delivery at a 20/week rate. Yields: 88%.

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Medical Solution #3

Customer Required: Nuclear detector array (120 modules) for heart imaging machine. Replacability required. Modules interface with vacuum photomultiplier tubes.

Hybrid Solution: Custom socket, 1500 volt capacitors and resistor array. Custom flexible circuit and SMT semiconductors. Hi voltage "potting".

Technical considerations: Materials and laser trimming techniques developed for stability at 2 megohms and 1500 volts. Moisture sensitivity required development of silicone encapsulation materials. Array structure required flexible circuit and associated pc board interconnect.

Reliability: Very high reliability--patient cannot be injected with nuclear isotopes a second time. Burn-in of 120 modules in finished unit performed by customer. Qualification of all lots of materials and traceability insures performance. Modular design facilitates repair.

Cost effectiveness: Non-recurring engineering expense approximates $2,500. Unit pricing at 1000 = $85.00.

Alternative technology: None

History: Layout: 3 weeks. Prototype fabrication: 6 weeks. Stress testing and engineering refinement: 4 weeks. Second prototype run: 5 weeks. Final delivery at a 250/month rate. Yields: 90%.

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Microwave

Customer Required: Digital telecommunications with a 30 millisecond (max) propagation delay. High density - light weight - microwave package. Custom integrated circuit required.

Hybrid Solution: Computer generated design: five metal layers, 220 ceramic printed through holes, 26 semiconductors & 330 wire bonds. Extensive computer modeling and prototyping.

Technical considerations: High reliability and sophisticated testing techniques. Substrates 100% continuity tested before assembly to maximize yield. 100% burn-in, wire bond pull test and electrical characterization. Careful layout and material selection minimized inductance and yielded a 22 millisecond propagation delay.

Reliability: Meets Mil-Std-883 level B requirements. Packaged in hermetically sealed (electron beam welded) microwave cavity. Extensive paperwork and documentation.

Cost effectiveness: Non-recurring engineering expense: $6,000. Unit pricing at 250 = $340.

Alternative technology: None

History: Layout: 8 weeks. Custom chip delivery late-thin film circuit used. Prototype fabrication: 6 weeks. Custom chip layout modifications: 2 weeks. Second prototype run: 5 weeks. Final delivery at a 20/week rate. Yields: 86%.

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Sensors

Customer Required: Motion, magnetic, temperature, pressure, distance, velocity & acceleration sensors with a variety of mechanical and electrical requirements.

Hybrid Solution: Hall effect transistors, ceramic and quartz capacitors, thermistors, silicon temperature sensors, inductors, strain gauges, silicon and germanium transducers, piezoelectric and thermoelectric devices mounted on alumina ceramic headers or bases.

Technical considerations: Customer requirements: measurement range and type, accuracy, repeatability,operational temperature, short and long term stability, physical & economic constraints, etc. Fabrication requirements: mechanical, electrical, test, quality, reproducibility and material.

Reliability: Typically commercial product with no mil testing. Can be qual tested to Mil-Std-883 and specific requirements. Packaging varies with end use. 100% electrical and mechanical performance testing, as required.

Cost effectiveness: Non-recurring engineering expense rarely exceeds $1,500. Units typically less than $20 (1,000), often less than $1.00.

Alternative technology: Size and/or physical configuration usually preclude alternatives.

Delivery: 4-8 weeks, dependent upon complexity. Typical yields: 80-90%.

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Surface Mounting Commercial

Customer Required: Plastic packaging for cost effective assembly with moderate space, weight and performance considerations - commercial and industrial applications.

Hybrid Solution: Small outline transistor and integrated circuit packages, up to 144 pins.

Technical considerations: Careful layout and material selection optimize productivity: matching of mounting pad geometry to devices, controlled solder paste application, adequate filleting, and reflow methods. Choice of solder composition depends upon subsequent operations - high temperature solder often required.

Reliability: Proper design guidelines allow thermal stress and adequate bond strength. Plastic packages meet all commercial requirements.

Cost effectiveness: Highly dependent upon package type. Plastic IC's are used in large numbers and are inexpensive.

Alternative technology: Discrete packages mounted on pc boards.

History: Highly dependent upon part requirements, volume, size, etc.

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Surface Mounting Military

Customer Required: Ceramic package/multilayer motherboards for test/burn-in of complex semiconductors (cpu, memory, etc.) Before assembly - high rel military applications.

Hybrid Solution: Small outline transistor and integrated circuit packages, up to 144 pins.

Technical considerations: Careful layout and material selection optimize productivity: matching of mounting pad geometry to devices, controlled solder paste application, adequate filleting, and reflow methods. Equipment and methods for efficient and thorough flux removal must be maintained. Choice of solder composition depends upon subsequent operations - high temp solder often required.

Reliability: Proper design guidelines allow thermal stress and adequate bond strength. Ceramic packages pass Mil-Std-883 requirements. Good thermal dissipation with all ceramic assembly.

Cost effectiveness: Ceramic packages relatively expensive.

Alternative technology: Chip and wire hybrids. Chips that cannot be readily tested are more cost effective in LCC ceramic packages.

History: Highly dependent upon part requirements, volume, size, etc.

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